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Journal: Micromachines, 2026
Volume: 17
Number: 686
686
Article: Optimization and Predictive Modeling of SiC Wafer Dicing Using a Thin Diamond Grinding Wheel via RSM and NSGA-II
Authors: by Jian Liu, Meiling Du, Jinzhong Wu, Sheng Gong, Penggen Ouyang, Shuai Huang and Fengjun Chen
Link: https://www.mdpi.com/2072-666X/17/6/686

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