Next Article in Journal
Development, Design, and Electrical Performance Simulation of Novel Through-Type 3D Semi Spherical Electrode Detector Based on SOI Substrate
Previous Article in Journal
Editorial for Special Issue on Ultra-Precision Machining of Difficult-to-Machine Materials
Previous Article in Special Issue
Pre-Silicon Accurate SPICE Modeling of Trench MOSFETs via Advanced TCAD Simulations and Dynamic Validation
 
 
Article

Article Versions Notes

Micromachines 2025, 16(9), 1005; https://doi.org/10.3390/mi16091005 (registering DOI)
Action Date Notes Link
article pdf uploaded. 30 August 2025 14:32 CEST Version of Record https://www.mdpi.com/2072-666X/16/9/1005/pdf
Back to TopTop