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Journal: Micromachines, 2025
Volume: 16
Number: 669
669
Article: Overview of Research Progress and Application Prospects of Thermal Test Chips
Authors: by Lina Ju, Peng Jiang, Yu Ren, Ruiwen Liu, Yanmei Kong, Shichang Yun, Yuxin Ye, Binbin Jiao, Qixing Hao and Honglin Sun
Link: https://www.mdpi.com/2072-666X/16/6/669

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