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Journal: Micromachines, 2025
Volume: 16
Number: 1292
1292
Article: Multiscale Modeling of Thermo–Electro–Mechanical Coupling of BGA Solder Joints in Microelectronic Systems of Ruggedized Computers for Signal Integrity Analysis
Authors: by Pan Li, Jin Huang, Jie Zhang, Hongxiao Gong, Jianjun Wang, Daijiang Zuo, Mengyang Su and Jiwei Shi
Link: https://www.mdpi.com/2072-666X/16/11/1292

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