Wang, L.; Jiang, L.; Ma, N.; Huang, X.
Correction: Wang et al. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. Micromachines 2024, 15, 1085. Micromachines 2025, 16, 1161.
https://doi.org/10.3390/mi16101161
AMA Style
Wang L, Jiang L, Ma N, Huang X.
Correction: Wang et al. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. Micromachines 2024, 15, 1085. Micromachines. 2025; 16(10):1161.
https://doi.org/10.3390/mi16101161
Chicago/Turabian Style
Wang, Lifeng, Lili Jiang, Ning Ma, and Xiaodong Huang.
2025. "Correction: Wang et al. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. Micromachines 2024, 15, 1085" Micromachines 16, no. 10: 1161.
https://doi.org/10.3390/mi16101161
APA Style
Wang, L., Jiang, L., Ma, N., & Huang, X.
(2025). Correction: Wang et al. Temperature Effects in Packaged RF MEMS Switches with Optimized Gold Electroplating Process. Micromachines 2024, 15, 1085. Micromachines, 16(10), 1161.
https://doi.org/10.3390/mi16101161