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Micromachines
Volume 15
Issue 5
10.3390/mi15050643
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Editorial

Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition

by
Dawei Wang
and
Wensheng Zhao
*
School of Electronics and Information and School of Integrated Circuit Science and Engineering, Hangzhou Dianzi University, Hangzhou 310018, China
*
Author to whom correspondence should be addressed.
Micromachines 2024, 15(5), 643; https://doi.org/10.3390/mi15050643
Submission received: 6 May 2024 / Accepted: 8 May 2024 / Published: 11 May 2024
(This article belongs to the Special Issue Advanced Interconnect and Packaging, 2nd Edition)
Versions Notes

Excerpt

Note: In lieu of an abstract, this is an excerpt from the first page.

Interconnect and packaging technologies are crucial aspects of modern electronics, and they are essential to achieve high performance, miniaturization and low power consumption of electronic equipment [...]

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MDPI and ACS Style

Wang, D.; Zhao, W. Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition. Micromachines 2024, 15, 643. https://doi.org/10.3390/mi15050643

AMA Style

Wang D, Zhao W. Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition. Micromachines. 2024; 15(5):643. https://doi.org/10.3390/mi15050643

Chicago/Turabian Style

Wang, Dawei, and Wensheng Zhao. 2024. "Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition" Micromachines 15, no. 5: 643. https://doi.org/10.3390/mi15050643

APA Style

Wang, D., & Zhao, W. (2024). Editorial for the Special Issue on Advanced Interconnect and Packaging, 2nd Edition. Micromachines, 15(5), 643. https://doi.org/10.3390/mi15050643

Note that from the first issue of 2016, this journal uses article numbers instead of page numbers. See further details here.

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