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Journal: Micromachines, 2024
Volume: 15
Number: 300
Article:
Optimizing Binding Site Spacing in Fluidic Self-Assembly for Enhanced Microchip Integration Density
Authors:
by
Myeongho Park, Bin Yoo, Myeonghwan Hong, Daeun Cho, Yunjin Jeong, Cheolheon Park, Jaemin Kim, Tae-Min Ha, Garam Kim, Sang Jeen Hong and Daewon Lee
Link:
https://www.mdpi.com/2072-666X/15/3/300
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