Guan, H.; Wang, D.; Li, W.; Liu, D.; Deng, B.; Qu, X.
Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices. Micromachines 2024, 15, 98.
https://doi.org/10.3390/mi15010098
AMA Style
Guan H, Wang D, Li W, Liu D, Deng B, Qu X.
Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices. Micromachines. 2024; 15(1):98.
https://doi.org/10.3390/mi15010098
Chicago/Turabian Style
Guan, He, Dong Wang, Wentao Li, Duo Liu, Borui Deng, and Xiang Qu.
2024. "Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices" Micromachines 15, no. 1: 98.
https://doi.org/10.3390/mi15010098
APA Style
Guan, H., Wang, D., Li, W., Liu, D., Deng, B., & Qu, X.
(2024). Simulation on an Advanced Double-Sided Cooling Flip-Chip Packaging with Diamond Material for Gallium Oxide Devices. Micromachines, 15(1), 98.
https://doi.org/10.3390/mi15010098