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Journal: Micromachines, 2023
Volume: 14
Number: 1612

Article: Copper Wire Bonding: A Review
Authors: by Hongliang Zhou, Andong Chang, Junling Fan, Jun Cao, Bin An, Jie Xia, Jingguang Yao, Xiaobin Cui and Yingchong Zhang
Link: https://www.mdpi.com/2072-666X/14/8/1612

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