Gong, G.; Xu, D.; Xiong, S.; Yi, F.; Wang, C.; Li, R.
An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate. Micromachines 2023, 14, 2025.
https://doi.org/10.3390/mi14112025
AMA Style
Gong G, Xu D, Xiong S, Yi F, Wang C, Li R.
An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate. Micromachines. 2023; 14(11):2025.
https://doi.org/10.3390/mi14112025
Chicago/Turabian Style
Gong, Guangping, Dian Xu, Sijun Xiong, Fangyu Yi, Chengbo Wang, and Rui Li.
2023. "An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate" Micromachines 14, no. 11: 2025.
https://doi.org/10.3390/mi14112025
APA Style
Gong, G., Xu, D., Xiong, S., Yi, F., Wang, C., & Li, R.
(2023). An Analytical Thermal Buckling Model for Semiconductor Chips on a Substrate. Micromachines, 14(11), 2025.
https://doi.org/10.3390/mi14112025