Next Article in Journal
Enhanced Performance of La0.8Sr0.2FeO3-δ-Gd0.2Ce0.8O2-δ Cathode for Solid Oxide Fuel Cells by Surface Modification with BaCO3 Nanoparticles
Next Article in Special Issue
Average Power Handling Capability of Corrugated Slow-Wave Transmission Lines
Previous Article in Journal
Characterization of Fluidic-Barrier-Based Particle Generation in Centrifugal Microfluidics
Previous Article in Special Issue
A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly
 
 

Order Article Reprints

Journal: Micromachines, 2022
Volume: 13
Number: 883

Article: Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects
Authors: by Wen-Sheng Zhao, Rui Zhang and Da-Wei Wang
Link: https://www.mdpi.com/2072-666X/13/6/883

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop