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Journal: MicromachinesVolume: 13Number: 883
Article: Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects
  • Authors:
  • Wen-Sheng Zhao1,*,
  • Rui Zhang2 and
  • Da-Wei Wang1
Link: https://www.mdpi.com/2072-666X/13/6/883

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