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Journal: Micromachines, 2022
Volume: 13
Number: 506

Article: Multi-Foci Laser Separation of Sapphire Wafers with Partial Thickness Scanning
Authors: by Celescia Siew Mun Lye, Zhongke Wang and Yee Cheong Lam
Link: https://www.mdpi.com/2072-666X/13/4/506

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