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Journal: Micromachines, 2022
Volume: 13
Number: 2081
Article:
Fabrication of Ultra-Fine Micro-Vias in Non-Photosensitive Polyimide for High-Density Vertical Interconnects
Authors:
by
Yao Wang, Chuan Hu, Xun Xiang, Wei Zheng, Zhendong Yin and Yinhua Cui
Link:
https://www.mdpi.com/2072-666X/13/12/2081
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