Veltkamp, H.-W.; Janssens, Y.L.; de Boer, M.J.; Zhao, Y.; Wiegerink, R.J.; Tas, N.R.; Lötters, J.C.
Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD. Micromachines 2022, 13, 1908.
https://doi.org/10.3390/mi13111908
AMA Style
Veltkamp H-W, Janssens YL, de Boer MJ, Zhao Y, Wiegerink RJ, Tas NR, Lötters JC.
Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD. Micromachines. 2022; 13(11):1908.
https://doi.org/10.3390/mi13111908
Chicago/Turabian Style
Veltkamp, Henk-Willem, Yves L. Janssens, Meint J. de Boer, Yiyuan Zhao, Remco J. Wiegerink, Niels R. Tas, and Joost C. Lötters.
2022. "Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD" Micromachines 13, no. 11: 1908.
https://doi.org/10.3390/mi13111908
APA Style
Veltkamp, H.-W., Janssens, Y. L., de Boer, M. J., Zhao, Y., Wiegerink, R. J., Tas, N. R., & Lötters, J. C.
(2022). Method for Keyhole-Free High-Aspect-Ratio Trench Refill by LPCVD. Micromachines, 13(11), 1908.
https://doi.org/10.3390/mi13111908