Next Article in Journal
Enhanced Performance of Perovskite Light-Emitting Diodes via Phenylmethylamine Passivation
Next Article in Special Issue
Combined Effect of TID Radiation and Electrical Stress on NMOSFETs
Previous Article in Journal
Recent Advances in Tracking Devices for Biomedical Ultrasound Imaging Applications
Previous Article in Special Issue
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
 
 

Order Article Reprints

Journal: Micromachines, 2022
Volume: 13
Number: 1856

Article: Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing
Authors: by Youngseok Lee, Yebin You, Chulhee Cho, Sijun Kim, Jangjae Lee, Minyoung Kim, Hanglim Lee, Youngjun You, Kyungman Kim and ShinJae You
Link: https://www.mdpi.com/2072-666X/13/11/1856

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop