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Lee Y, You Y, Cho C, Kim S, Lee J, Kim M, Lee H, You Y, Kim K, You S. Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO₂ Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines. 2022; 13(11):1856. https://doi.org/10.3390/mi13111856

Lee, Youngseok, Yebin You, Chulhee Cho, Sijun Kim, Jangjae Lee, Minyoung Kim, Hanglim Lee, Youngjun You, Kyungman Kim, and ShinJae You. 2022. "Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO₂ Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing" Micromachines 13, no. 11: 1856. https://doi.org/10.3390/mi13111856

Lee, Y., You, Y., Cho, C., Kim, S., Lee, J., Kim, M., Lee, H., You, Y., Kim, K., & You, S. (2022). Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO₂ Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines, 13(11), 1856. https://doi.org/10.3390/mi13111856