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Journal: Micromachines, 2022
Volume: 13
Number: 1856
Article:
Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing
Authors:
by
Youngseok Lee, Yebin You, Chulhee Cho, Sijun Kim, Jangjae Lee, Minyoung Kim, Hanglim Lee, Youngjun You, Kyungman Kim and ShinJae You
Link:
https://www.mdpi.com/2072-666X/13/11/1856
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