Lee, Y.;                     You, Y.;                     Cho, C.;                     Kim, S.;                     Lee, J.;                     Kim, M.;                     Lee, H.;                     You, Y.;                     Kim, K.;                     You, S.    
        Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines 2022, 13, 1856.
    https://doi.org/10.3390/mi13111856
    AMA Style
    
                                Lee Y,                                 You Y,                                 Cho C,                                 Kim S,                                 Lee J,                                 Kim M,                                 Lee H,                                 You Y,                                 Kim K,                                 You S.        
                Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines. 2022; 13(11):1856.
        https://doi.org/10.3390/mi13111856
    
    Chicago/Turabian Style
    
                                Lee, Youngseok,                                 Yebin You,                                 Chulhee Cho,                                 Sijun Kim,                                 Jangjae Lee,                                 Minyoung Kim,                                 Hanglim Lee,                                 Youngjun You,                                 Kyungman Kim,                                 and ShinJae You.        
                2022. "Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing" Micromachines 13, no. 11: 1856.
        https://doi.org/10.3390/mi13111856
    
    APA Style
    
                                Lee, Y.,                                 You, Y.,                                 Cho, C.,                                 Kim, S.,                                 Lee, J.,                                 Kim, M.,                                 Lee, H.,                                 You, Y.,                                 Kim, K.,                                 & You, S.        
        
        (2022). Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines, 13(11), 1856.
        https://doi.org/10.3390/mi13111856