Lee, Y.; You, Y.; Cho, C.; Kim, S.; Lee, J.; Kim, M.; Lee, H.; You, Y.; Kim, K.; You, S.
Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines 2022, 13, 1856.
https://doi.org/10.3390/mi13111856
AMA Style
Lee Y, You Y, Cho C, Kim S, Lee J, Kim M, Lee H, You Y, Kim K, You S.
Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines. 2022; 13(11):1856.
https://doi.org/10.3390/mi13111856
Chicago/Turabian Style
Lee, Youngseok, Yebin You, Chulhee Cho, Sijun Kim, Jangjae Lee, Minyoung Kim, Hanglim Lee, Youngjun You, Kyungman Kim, and ShinJae You.
2022. "Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing" Micromachines 13, no. 11: 1856.
https://doi.org/10.3390/mi13111856
APA Style
Lee, Y., You, Y., Cho, C., Kim, S., Lee, J., Kim, M., Lee, H., You, Y., Kim, K., & You, S.
(2022). Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing. Micromachines, 13(11), 1856.
https://doi.org/10.3390/mi13111856