Next Article in Journal
Investigation of Deep Spiking Neural Networks Utilizing Gated Schottky Diode as Synaptic Devices
Next Article in Special Issue
Comprehensive Assessments in Bonding Energy of Plasma Assisted Si-SiO2 Direct Wafer Bonding after Low Temperature Rapid Thermal Annealing
Previous Article in Journal
Electrochemical Testing of a New Polyimide Thin Film Electrode for Stimulation, Recording, and Monitoring of Brain Activity
Previous Article in Special Issue
Using Chiplet Encapsulation Technology to Achieve Processing-in-Memory Functions
 
 

Order Article Reprints

Journal: Micromachines, 2022
Volume: 13
Number: 1799

Article: Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
Authors: by Jin Zhao, Zuohuan Chen, Fei Qin and Daquan Yu
Link: https://www.mdpi.com/2072-666X/13/10/1799

MDPI offers high quality article reprints with convenient shipping to destinations worldwide. Each reprint features a 270 gsm bright white cover and 105 gsm premium white paper, bound with two stitches for durability and printed in full color. The cover design is customized to your article and designed to be complimentary to the journal.

Order Cost and Details

Shipping Address

Billing Address

Notes or Comments

Validate and Place Order

The order must be prepaid after it is placed

req denotes required fields.
Back to TopTop