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Journal: Micromachines, 2022
Volume: 13
Number: 77
Article:
Research on Heat Dissipation of Multi-Chip LED Filament Package
Authors:
by
Lipeng Tan, Peisheng Liu, Chenhui She, Pengpeng Xu, Lei Yan and Hui Quan
Link:
https://www.mdpi.com/2072-666X/13/1/77
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