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Micromachines2021, 12(4), 361;https://doi.org/10.3390/mi12040361

Journal: MicromachinesVolume: 12Number: 361

Article: A New Approach for the Control and Reduction of Warpage and Residual Stresses in Bonded Wafer

Authors:
Seyed Amir Fouad Farshchi Yazdi¹,
Matteo Garavaglia² and
Aldo Ghisi¹
et al.

Link: https://www.mdpi.com/2072-666X/12/4/361

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