Shan, G.; Li, G.; Chen, D.; Yang, Z.; Li, D.; Yang, Y.
An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias. Micromachines 2021, 12, 1223.
https://doi.org/10.3390/mi12101223
AMA Style
Shan G, Li G, Chen D, Yang Z, Li D, Yang Y.
An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias. Micromachines. 2021; 12(10):1223.
https://doi.org/10.3390/mi12101223
Chicago/Turabian Style
Shan, Guangbao, Guoliang Li, Dongdong Chen, Zifeng Yang, Di Li, and Yintang Yang.
2021. "An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias" Micromachines 12, no. 10: 1223.
https://doi.org/10.3390/mi12101223
APA Style
Shan, G., Li, G., Chen, D., Yang, Z., Li, D., & Yang, Y.
(2021). An Anisotropic Equivalent Thermal Model for Shield Differential Through-Silicon Vias. Micromachines, 12(10), 1223.
https://doi.org/10.3390/mi12101223