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Journal: Micromachines, 2020
Volume: 11
Number: 759

Article: The Mechanism of Layer Stacked Clamping (LSC) for Polishing Ultra-Thin Sapphire Wafer
Authors: by Zhixiang Chen, Linlin Cao, Julong Yuan, Binghai Lyu, Wei Hang and Jiahuan Wang
Link: https://www.mdpi.com/2072-666X/11/8/759

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