Safe Coated Microneedles with Reduced Puncture Occurrence after Administration
Abstract
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Jeong, H.-R.; Jun, H.; Cha, H.-R.; Lee, J.M.; Park, J.-H. Safe Coated Microneedles with Reduced Puncture Occurrence after Administration. Micromachines 2020, 11, 710. https://doi.org/10.3390/mi11080710
Jeong H-R, Jun H, Cha H-R, Lee JM, Park J-H. Safe Coated Microneedles with Reduced Puncture Occurrence after Administration. Micromachines. 2020; 11(8):710. https://doi.org/10.3390/mi11080710
Chicago/Turabian StyleJeong, Hye-Rin, Hyesun Jun, Hye-Ran Cha, Jae Myun Lee, and Jung-Hwan Park. 2020. "Safe Coated Microneedles with Reduced Puncture Occurrence after Administration" Micromachines 11, no. 8: 710. https://doi.org/10.3390/mi11080710
APA StyleJeong, H.-R., Jun, H., Cha, H.-R., Lee, J. M., & Park, J.-H. (2020). Safe Coated Microneedles with Reduced Puncture Occurrence after Administration. Micromachines, 11(8), 710. https://doi.org/10.3390/mi11080710

