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Yamamoto M, Matsumae T, Kurashima Y, Takagi H, Suga T, Takamatsu S, Itoh T, Higurashi E. Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding. Micromachines. 2020; 11(5):454. https://doi.org/10.3390/mi11050454

Yamamoto, Michitaka, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Seiichi Takamatsu, Toshihiro Itoh, and Eiji Higurashi. 2020. "Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding" Micromachines 11, no. 5: 454. https://doi.org/10.3390/mi11050454

Yamamoto, M., Matsumae, T., Kurashima, Y., Takagi, H., Suga, T., Takamatsu, S., Itoh, T., & Higurashi, E. (2020). Effect of Au Film Thickness and Surface Roughness on Room-Temperature Wafer Bonding and Wafer-Scale Vacuum Sealing by Au-Au Surface Activated Bonding. Micromachines, 11(5), 454. https://doi.org/10.3390/mi11050454