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Journal: Micromachines, 2020
Volume: 11
Number: 51

Article: Good-Quality and High-Efficiency Dicing for Thick LiNbO3 Wafers Using Picosecond Laser Pulses
Authors: by Mingwei Lei, Wenyan Gao, Guang Li, Xinping Wu, Benhai Li, Xuefeng Wang and Junlong Wang
Link: https://www.mdpi.com/2072-666X/11/1/51

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