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Journal: Micromachines, 2019
Volume: 10
Number: 563

Article: Fabrication of Simultaneously Implementing “Wired Face-Up and Face-Down Ultrathin Piezoresistive Si Chips” on a Film Substrate by Screen-Offset Printing
Authors: by Yusuke Takei, Ken-ichi Nomura, Yoshinori Horii, Daniel Zymelka, Hirobumi Ushijima and Takeshi Kobayashi
Link: https://www.mdpi.com/2072-666X/10/9/563

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