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Journal: Micromachines, 2019
Volume: 10
Number: 547

Article: Contact Photolithography at Sub-Micrometer Scale Using a Soft Photomask
Authors: by Chun-Ying Wu, Heng Hsieh and Yung-Chun Lee
Link: https://www.mdpi.com/2072-666X/10/8/547

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