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PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications

1
Faculty of Engineering and Natural Sciences, Sabanci University, 34956 Istanbul, Turkey
2
Sabancı University Nanotechnology Research and Application Center (SUNUM), 34956 Istanbul, Turkey
*
Author to whom correspondence should be addressed.
Micromachines 2019, 10(5), 319; https://doi.org/10.3390/mi10050319
Received: 11 April 2019 / Revised: 3 May 2019 / Accepted: 7 May 2019 / Published: 11 May 2019
(This article belongs to the Section A:Physics)
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Abstract

This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to other wafer-bonding methods and sacrificial-layer processes. A low-temperature (< 180 C ) bonding process was carried out in a purpose-built bonding tool to minimize the involvement of expensive laboratory equipment. A single-element CMUT comprising 16 cells of 2.5 mm radius and 800 nm cavity was fabricated. The center frequency of the device was set to 200 kHz for underwater communication purposes. Characterization of the device was carried out in immersion, and results were subsequently validated with data from Finite Element Analysis (FEA). Results show the feasibility of the fabricated CMUTs as receivers for underwater applications. View Full-Text
Keywords: Capacitive Micromachined Ultrasonic Transducers (CMUTs); wafer bonding; PMMA; underwater acoustics; Microelectromechanical Systems (MEMS) Capacitive Micromachined Ultrasonic Transducers (CMUTs); wafer bonding; PMMA; underwater acoustics; Microelectromechanical Systems (MEMS)
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This is an open access article distributed under the Creative Commons Attribution License which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited (CC BY 4.0).
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Ahmad, M.; Bozkurt, A.; Farhanieh, O. PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications. Micromachines 2019, 10, 319.

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