PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications
Faculty of Engineering and Natural Sciences, Sabanci University, 34956 Istanbul, Turkey
Sabancı University Nanotechnology Research and Application Center (SUNUM), 34956 Istanbul, Turkey
Author to whom correspondence should be addressed.
Received: 11 April 2019 / Revised: 3 May 2019 / Accepted: 7 May 2019 / Published: 11 May 2019
(This article belongs to the Section A：Physics
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This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to other wafer-bonding methods and sacrificial-layer processes. A low-temperature (<
) bonding process was carried out in a purpose-built bonding tool to minimize the involvement of expensive laboratory equipment. A single-element CMUT comprising 16 cells of 2.5
radius and 800
cavity was fabricated. The center frequency of the device was set to 200 kHz for underwater communication purposes. Characterization of the device was carried out in immersion, and results were subsequently validated with data from Finite Element Analysis (FEA). Results show the feasibility of the fabricated CMUTs as receivers for underwater applications.
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MDPI and ACS Style
Ahmad, M.; Bozkurt, A.; Farhanieh, O. PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications. Micromachines 2019, 10, 319.
Ahmad M, Bozkurt A, Farhanieh O. PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications. Micromachines. 2019; 10(5):319.
Ahmad, Mansoor; Bozkurt, Ayhan; Farhanieh, Omid. 2019. "PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications." Micromachines 10, no. 5: 319.
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