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Journal: Micromachines, 2019
Volume: 10
Number: 185

Article: Technological Platform for Vertical Multi-Wafer Integration of Microscanners and Micro-Optical Components
Authors: by Sylwester Bargiel, Maciej Baranski, Maik Wiemer, Jörg Frömel, Wei-Shan Wang and Christophe Gorecki
Link: https://www.mdpi.com/2072-666X/10/3/185

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