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Journal: Micromachines, 2019
Volume: 10
Number: 86

Article: In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures
Authors: by Chenglin Wu, Congjie Wei and Yanxiao Li
Link: https://www.mdpi.com/2072-666X/10/2/86

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