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Open AccessArticle

In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures

Department of Civil, Architectural, and Environmental Engineering, Missouri University of Science and Technology, Rolla, MO 65409, USA
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Micromachines 2019, 10(2), 86; https://doi.org/10.3390/mi10020086
Received: 7 December 2018 / Revised: 17 January 2019 / Accepted: 21 January 2019 / Published: 25 January 2019
(This article belongs to the Special Issue Small Scale Deformation using Advanced Nanoindentation Techniques)
In situ nanoindentation experiments have been widely adopted to characterize material behaviors of microelectronic devices. This work introduces the latest developments of nanoindentation experiments in the characterization of nonlinear material properties of 3D integrated microelectronic devices using the through-silicon via (TSV) technique. The elastic, plastic, and interfacial fracture behavior of the copper via and matrix via interface were characterized using small-scale specimens prepared with a focused ion beam (FIB) and nanoindentation experiments. A brittle interfacial fracture was found at the Cu/Si interface under mixed-mode loading with a phase angle ranging from 16.7° to 83.7°. The mixed-mode fracture strengths were extracted using the linear elastic fracture mechanics (LEFM) analysis and a fracture criterion was obtained by fitting the extracted data with the power-law function. The vectorial interfacial strength and toughness were found to be independent with the mode-mix. View Full-Text
Keywords: TSV; nanoindentation; FIB; micro-cantilever beam; mixed-mode; fracture TSV; nanoindentation; FIB; micro-cantilever beam; mixed-mode; fracture
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Wu, C.; Wei, C.; Li, Y. In Situ Mechanical Characterization of the Mixed-Mode Fracture Strength of the Cu/Si Interface for TSV Structures. Micromachines 2019, 10, 86.

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