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Materials 2014, 7(11), 7366-7378;

Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface

Department of Mechanical Engineering, Chang Gung University, Taoyuan 333, Taiwan
Author to whom correspondence should be addressed.
Received: 14 May 2014 / Revised: 9 October 2014 / Accepted: 6 November 2014 / Published: 14 November 2014
(This article belongs to the Special Issue Light Alloys and Their Applications)
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Cu electrodeposition was performed on a cylindrical AZ80 substrate with a U-shaped surface. A uniform deposition of Cu was achieved on an AZ80 electrode via galvanostatic etching, followed by Cu electrodeposition in an eco-friendly alkaline Cu plating bath. Improper wetting and lower rotational speeds of the AZ80 electrode resulted in an uneven Cu deposition at the inner upper site of the U-shaped surface during the Cu electroplating process. This wetting effect could be deduced from the variation in the anodic potential during the galvanostatic etching. The corrosion resistance of the Cu-deposited AZ80 electrode can be considerably improved after Ni electroplating. View Full-Text
Keywords: metal and alloys; thin films; corrosion; electrochemical reactions metal and alloys; thin films; corrosion; electrochemical reactions

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Huang, C.A.; Yeh, Y.H.; Lin, C.K.; Hsieh, C.Y. Copper Electrodeposition on a Magnesium Alloy (AZ80) with a U-Shaped Surface. Materials 2014, 7, 7366-7378.

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