An Overview of Chromic Transition Metal Oxide Thin Films
Abstract
1. Introduction
2. Materials Platform: Structural and Electronic Properties of Selected TMOs
2.1. Vanadium Oxides
2.1.1. V–O Binary Phase Diagram
2.1.2. Crystal Structure of Vanadium Dioxide VO2
2.1.3. Crystal Structure of Divanadium Trioxide V2O3
2.1.4. Crystal Structure of Divanadium Pentoxide V2O5
2.1.5. Electronic Structure of Vanadium Dioxide VO2
2.1.6. Electronic Structure of Divanadium Trioxide V2O3
2.1.7. Electronic Structure of Divanadium Pentoxide V2O5
2.2. Nickel Oxide
2.2.1. Ni–O Binary Phase Diagram
2.2.2. Crystal Structure of Nickel Oxide
2.2.3. Electronic Structure of Nickel Oxide
2.3. Tungsten Oxides
2.3.1. W–O Binary Phase Diagram
2.3.2. Crystal Structure of Tungsten Oxide WO3
2.3.3. Electronic Structure of Tungsten Oxide WO3
2.4. Titanium Oxides
2.4.1. Ti–O Binary Phase Diagram
2.4.2. Crystal Structure of Titanium Oxide
2.4.3. Electronic Structure of Titanium Oxide
2.5. Comparative Summary of Selected TMOs
3. Technology of TMO Preparation
3.1. Pulsed Laser Deposition
3.2. Magnetron Sputtering
3.3. Sol-Gel and Aerosol Spray Deposition
3.4. Other Deposition Methods
3.5. Comparative Analysis of TMO Thin Film Preparation Technologies
4. Devices and Applications
4.1. Thermochromic VO2-Based Smart Windows
4.2. Electrochromic WO3- and NiO-Based Smart Windows
4.3. Optical Hydrogen Detection Using TMO-Based Gasochromic Sensors
5. Future Perspectives
6. Conclusions
- –
- improving VO2 thermochromic coatings through reducing the transition temperature while preserving high luminous transmittance, strong solar modulation, narrow hysteresis, and environmental stability through doping, strain engineering, multilayer design, protective layers, and nanostructuring;
- –
- enhancing WO3/NiO-based electrochromic oxide devices, namely faster switching, lower operating voltage, higher optical contrast, better color neutrality, and longer cycling lifetime through improved ion transport, electrolyte compatibility, charge balance, and interface stability;
- –
- controlling defects and microstructure such as oxygen vacancies, mixed-valence states, grain boundaries, and porosity to tune optical modulation, ion diffusion, switching kinetics, and degradation;
- –
- expanding gasochromic WO3 and V2O5 devices for hydrogen sensing and optical gas detection through improving sensitivity, selectivity, reversibility, humidity tolerance, and stable low-temperature operation.
Author Contributions
Funding
Data Availability Statement
Conflicts of Interest
Abbreviations
| AACVD | Aerosol-assisted chemical vapor deposition |
| AFI | Antiferromagnetic insulating |
| ALD | Atomic layer deposition |
| AR | Antireflection |
| AZO | Aluminum-doped zinc oxide |
| CE | Coloration efficiency |
| CT | Charge-transfer |
| CVD | Chemical vapor deposition |
| DFT | Density functional theory |
| DGU | Double glazing unit |
| ECW | Electrochromic window |
| HiPIMS | High-power impulse magnetron sputtering |
| HRTEM | High-resolution transmission electron microscopy |
| IGU | Insulating glass unit |
| IR | Infrared |
| ITO | Indium tin oxide |
| LCST | Lower critical solution temperature |
| LPCVD | Low-pressure chemical vapor deposition |
| LPEs | Liquid/liquid-polymer electrolytes |
| MBE | Molecular beam epitaxy |
| MIR | Mid-infrared |
| MIT | Metal–insulator transition |
| MOX | Metal oxide |
| NIR | Near-infrared |
| PC | Propylene carbonate |
| PLD | Pulsed laser deposition |
| RFMS | Radio-frequency magnetron sputtering |
| RH | Relative humidity |
| SEM | Scanning electron microscopy |
| SHGC | Solar heat gain coefficient |
| SLG | Soda-lime glass |
| SPEs | Solid polymer electrolytes |
| SW | Smart window |
| SWs | Smart windows |
| TEM | Transmission electron microscopy |
| TGU | Triple glazing unit |
| TMM | Transfer matrix method |
| TMO | Transition metal oxide |
| TMOs | Transition metal oxides |
| UV | Ultraviolet |
| VIS | Visible |
| YSZ | Yttria-stabilized zirconia |
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| Atom | Wyckoff | Site Symmetry | x/a | y/b | z/c |
|---|---|---|---|---|---|
| V1 | 4e | 1 | 0.23947 | 0.97894 | 0.02646 |
| O2 | 4e | 1 | 0.10616 | 0.21185 | 0.20859 |
| O3 | 4e | 1 | 0.40051 | 0.70258 | 0.29884 |
| Atom | Wyckoff | Site Symmetry | x/a | y/b | z/c |
|---|---|---|---|---|---|
| V1 | 2a | m.mm | 0 | 0 | 0 |
| O2 | 4f | m.2m | 0.305 | 0.305 | 0 |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| V1 | 12c | 0 | 0 | 0.34629 |
| O2 | 18e | 0.3118 | 0 | 0.25 |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| V1 | 8f | 0.3445 | 0.0025 | 0.3001 |
| O1 | 8f | 0.4043 | 0.8493 | 0.6459 |
| O2 | 18e | 0.25 | 0.3166 | 0.5 |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| V | 4f | 0.10118 | 0.25 | 0.8917 |
| O1 | 4f | 0.1043 | 0.25 | 0.531 |
| O2 | 4f | −0.0689 | 0.25 | 0.003 |
| O3 | 2a | 0.25 | 0.25 | 0.001 |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| Ni1 | 4a | 0 | 0 | 0 |
| O2 | 4b | 1/2 | 1/2 | 1/2 |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| W1 | 1a | 0 | 0 | 0 |
| O2 | 3b | 1/2 | 0 | 0 |
| Phase | Structure | Lattice Parameters | Stability Temperature Range |
|---|---|---|---|
| –WO3 [53] | Tetragonal | 1010– | |
| (No. 129) | |||
| –WO3 [54] | Orthorhombic | 600– | |
| (No. 62) | |||
| –WO3 [8] | Monoclinic | 290– | |
| (No. 14) | |||
| –WO3 [55] | Triclinic | 230– | |
| (No. 2) | |||
| –WO3 [56] | Monoclinic | <230 K | |
| (No. 7) | |||
| H-WO3 [57] | Hexagonal | metastable | |
| (No. 191) |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| Ti1 | 4a | 0 | 0 | 0 |
| O2 | 8eb | 0 | 0 | 0.20806 |
| Atom | Wyckoff | x/a | y/b | z/c |
|---|---|---|---|---|
| Ti1 | 2a | 0 | 0 | 0 |
| O2 | 4f | 0.306 | 0.306 | 0 |
| Properties | Vanadium Oxides | Nickel Oxides | Tungsten Oxides | Titanium Oxides |
|---|---|---|---|---|
| Stoichiometry/ Oxidation state | – VO2; V4+; | – NiO; Ni2+; | – WO3; W6+; | – TiO2; Ti4+; |
| – V2O3; V3+; | – O; | – ; | – ; | |
| – V2O5; V5+; | Ni vacancies; | W5+/W6+ states | oxygen vacancies; | |
| – / | Ni3+ states | Ti3+ states | ||
| ; mixed-valence phases | – ; Ti3+/Ti4+ Magnéli phases | |||
| Crystal Structure/ Main Phases | VO2: monoclinic M1 (, No. 14); | NiO: rock-salt (, No. 225) | -WO3: tetragonal (, No. 129); | TiO2: anatase (, No. 141); |
| VO2: monoclinic M2 (, No. 12); | -WO3: orthorhombic (Pnma, No. 62); | TiO2: rutile (, No. 136) | ||
| VO2: rutile R (, No. 136); | -WO3: monoclinic (, No. 14); | TiO2: brookite (, No. 61) | ||
| V2O3: corundum (, No. 167); | -WO3: triclinic (, No. 2); | |||
| V2O3: monoclinic (, No. 15); | -WO3: monoclinic (, No. 7); | |||
| V2O5: orthorhombic (, No. 59) | H-WO3: hexagonal (, No. 191) | |||
| Electronic Structure | VO2: correlated oxide; V- states split into and ; temperature-driven MIT | CT/correlated insulator; O- states dominate the valence band; | wide-band-gap oxide; O- valence band and W- conduction band; | wide-band-gap oxide; O- valence band and Ti- conduction band; |
| V2O3: strongly correlated oxide; states split into and by trigonal distortion; Mott–Hubbard-type MIT | Ni- states contribute to unoccupied states and multiplet/CT excitations | electron/ion insertion creates W5+/W6+ states | oxygen vacancies and Ti3+ states introduce defect levels | |
| V2O5: insulating CT oxide; O- valence band and V- conduction band; | ||||
| Main Chromic Mechanism | VO2: Peierls-Mott MIT & V2O3: Mott MIT → thermochromism; | deintercalation/hole-polaron formation → anodic electrochromism > Alexandru V.: | intercalation/electron-polaron formation → cathodic electrochromism and gasochromism | photoinduced charge trapping/small-polaron formation → photochromism |
| V2O5: intercalation/deintercalation → electrochromism/gasochromism |
| TMO | Substrate | PLD Parameters | Laser Type and Parameters |
|---|---|---|---|
| Pt(111)/ [75] | Substrate temperature: Distance to substrate: Working pressure Target: | KrF excimer Frequency: Fluence: Deposition time: – | |
| Si/ [76] | Substrate temperature: Distance to substrate: Working pressure Target: V-metal | KrF excimer Frequency: Fluence: Deposition time: | |
| Soda lime glass (SLG) [77] | Substrate temperature: 450– Distance to substrate: Working pressure Target: V-metal | KrF excimer Frequency: Fluence: Deposition time: | |
| c-plane sapphire [78] | Substrate temperature: Distance to substrate: Working pressure – Target: | KrF excimer Frequency: Fluence: – Deposition time: – | |
| Sapphire [79] | Substrate temperature: Working pressure – Target: | ArF excimer Frequency: – Fluence: – Deposition time: – | |
| Si/ [80] | Substrate temperature: Distance to substrate: Working pressure Target: | KrF excimer Frequency: Laser energy: Deposition time: – | |
| Sapphire [81] | Substrate temperature: Distance to substrate: Working pressure Target: Flow | KrF excimer Frequency: – Fluence: – Deposition time: – | |
| : (FTO)-coated glass [82] | Substrate temperature: RT– Distance to substrate: 40– Working pressure – Target: | KrF excimer Frequency: Fluence: – Deposition time: 30– | |
| : (FTO)-coated glass [83] | Substrate temperature: RT– Distance to substrate: Working pressure Target: Ni-metal | KrF excimer Frequency: Fluence: Deposition time: – | |
| ITO-coated glass [84] | Substrate temperature: RT– Working pressure – Target: Flow | KrF excimer Frequency: 5– Laser energy: Deposition time: – | |
| Si(100) [85] | Substrate temperature: 300– Distance to substrate: Working pressure Target: | ArF excimer Frequency: Fluence: Deposition time: | |
| [86] | Substrate temperature: 300– Working pressure – Target: | KrF excimer Frequency: Fluence: – Deposition time: – | |
| ITO-coated glass, Si [87] | Substrate temperature: 25– Distance to substrate: Working pressure Target: (anatase and rutile) | Femtosecond laser Frequency: Fluence: Deposition time: – | |
| Aluminum foil, Si(100) [88] | Substrate temperature: RT Distance to substrate: Without oxygen Target: (anatase) | Nd:glass Frequency: Laser energy: Deposition time: |
| TMO | Magnetron Sputtering Technique | Deposition Parameters | Substrate and Target Parameters | Ambient Conditions |
|---|---|---|---|---|
| RF [99] | Sputtering power: | Substrate: Corning glass Substrate temperature: Target: V | Working pressure: | |
| RF [100] | Sputtering power: | Substrates: Si(100), glass Substrate temperature: Distance to substrate: Target: V | Working pressure: – Flow rate | |
| RF [101] | – | Substrates: /Si, c-plane sapphire Substrate temperature: Target: V | Working pressure: | |
| DC [102] | Sputtering power: 90– | Substrates: /Si, quartz sapphire Substrate temperature: Target: V | Working pressure: Flow rate Flow rate | |
| Magnetron sputtering [103] | Power density on V-target: | Substrate: SLG Substrate temperature: 300– Target: V | Working pressure: Flow rate Flow rate | |
| DC [104] | Sputtering power: | Substrates: Al, KCl, glass Substrate temperature: RT Distance to substrate: Target: Ni | Working pressure: | |
| DC [47] | Sputtering power: 30– | Substrate: glass Substrate temperature: RT Distance to substrate: Target: Ni | Working pressure: | |
| RF [105] | Sputtering power: | Substrate: SLG Substrate temperature: RT Target: NiO | Working pressure: Flow rate | |
| DC [106] | Sputtering power: | Substrate: Substrate temperature: Target: W | Working pressure: – | |
| RF [107] | Sputtering power: | Substrate: ITO-coated glass Substrate temperature: RT Target: | Working pressure: Flow rate | |
| DC [108] | Sputtering power: 0– | Substrate: Ti/FTO Substrate temperature: RT Distance to substrate: Target: Ti | Working pressure: Flow rate Flow rate | |
| RF [109] | Sputtering power: 80– | Substrates: Si(100), glass Substrate temperature: RT– Target: | Working pressure: 4– Flow rate – | |
| RF [110] | Sputtering power: | Substrate: p-Si(100) Substrate temperature: RT Distance to substrate: Target: | Working pressure: Flow rate – | |
| RF [111] | Sputtering power: | Substrate: glass Substrate temperature: RT Target: | Working pressure: Flow rate |
| TMO | Substrate | PLD Parameters | Laser Type and Parameters |
|---|---|---|---|
| Spin coating [117] | Substrate: Si Source of TM: Sol: of in ethanol | Drying at 1. humid : – (11– RH at 22–) 2. dry air: – (14– RH at 21–) 3. ambient air: – (34– RH at ) 4. humid air: – (85– RH at 20–) Annealing at for () under a flux | |
| Spin coating [118] | Substrates: Si, quartz Source of TM: ammonium citrato-oxovanadate (IV) (CA-V(IV)) Sol: CA-V(IV) + ethanol + cetyltrimethylammonium bromide (CTAB) + distilled water, with varying molar ratio of CTAB to V | Annealing at for in Ar atmosphere | |
| Spin coating [119] | Substrate: Source of TM: vanadyl triisopropoxide Sol: of , isopropanol and acetic acid with mass ratio of , respectively | Drying at for Annealing at 370– for in with flow rate | |
| Spin coating [120] | Substrate: glass Source of TM: nanocrystalline NiO powder Sol: nanocrystalline NiO powder + m-cresol | Drying at for | |
| Spin coating [121] | Substrate: – Source of TM: nickel acetate tetrahydrate Sol: of nickel acetate tetrahydrate + of aqueous citric acid solution and of ethylene glycol | Drying at for at atmospheric pressure Annealing at for | |
| Spin & dip coating [122] | Substrates: ITO-coated glass, Corning glass Source of TM: Nickel(II) 2-ethylhexanoate Sol: of Nickel(II) 2-ethylhexanoate + isopropanol | Drying at RT in air for Annealing at for | |
| Spin coating [123] | Substrate: ITO-coated glass Source of TM: tungsten (VI) chloride () powder Sol: of of absolute ethanol of glacial acetic acid of | Drying at for Annealing at | |
| Dip coating [124] | Substrate: glass Source of TM: Sol: of + of | Drying at for Air-annealing at 150– for () | |
| Sol–gel [125] | Substrates: FTO-coated glass, glass Source of TM: tungsten (VI) chloride () powder Sol: of of of 2-methoxyethanol | Drying at RT for in air Air-annealing at for | |
| Dip coating [126] | Substrate: glass Source of TM: titanium tetra-isopropoxide (TTIP) Sol: TTIP, 1-propanol, hydrochloric acid (HCl, ), and monoethanolamine | Drying at for Preheated at for Annealing at for | |
| Dip coating [127] | Substrates: SLG, quartz Source of TM: titanium tetra-isopropoxide (TTIP) Sol: TTIP, isopropanol , glacial acetic acid and methanol | Drying at for Annealing at 350– for | |
| Spin coating [128] | Substrate: glass Source of TM: nanocrystalline powder Sol: of nanocrystalline powder of ethanol of diethylene glycol | Drying at for Annealing at |
| TMO Preparation Technology | Main Advantages | Main Limitations | Device Integration Aspects |
|---|---|---|---|
| Magnetron Sputtering | Scalable to large-area coatings; industry-compatible; good thickness and uniformity control | Requires optimization of oxygen partial pressure, stress, crystallinity, and post-annealing; reactive sputtering may suffer from target poisoning and process hysteresis; phase control can be challenging for multivalent oxides | Highly relevant for SW and multilayer coatings; compatible with glass substrates and industrial coating lines |
| PLD | Good stoichiometry transfer; suitable for complex and multicomponent oxides; precise control of deposition parameters, including oxygen pressure, laser fluence, and substrate temperature | Limited scalability; relatively small deposition area; possible formation of particulates/droplets; relatively high cost and low throughput | Excellent for model films and mechanism studies; less attractive for industrial large-area devices |
| Sol–gel | Low cost; simple equipment; compositional flexibility; potentially scalable to large-area coatings | Cracking, porosity, thickness non-uniformity, organic residues, low oxygen control, and the need for thermal treatment | Useful for low-cost coatings, but device reproducibility and long-term stability require careful control |
| Dopant | Mechanism | |||
|---|---|---|---|---|
| [151,152] | Decrease in – | Increased free electron concentration | ||
| [153,154] | Increase | Smaller ionic radius | ||
| [155] | 22– | – | Decrease in | Increased free electron concentration |
| [156,157] | Decrease in | Increased free hole concentration | ||
| [158] | Decrease in | Larger ionic radius | ||
| [159] | – | – | Increase | Increased free hole concentration |
| [160] | – | – | Increase in | Smaller ionic radius |
| [161] | 52– | – | Decrease in | Larger ionic radius |
| [162] | Decrease | Increased free hole and electron concentrations | ||
| [158] | Decrease | Increased free electron concentration | ||
| [163] | – | – | Decrease | Increased free electron concentration |
| AR Materials | n at = 550 nm | Design and Architecture |
|---|---|---|
| [166] | ∼1.45 | Top AR |
| [164] | – | Top and bottom AR, self-cleaning, photocatalyst |
| [167] | – | Top and bottom AR |
| [168] | – | Top and bottom AR |
| [169] | – | Bottom AR + UV shielding |
| [170] | – | Top and bottom AR |
| [171] | – | Top and bottom AR |
| [172] | – | Top and bottom AR |
| Electrolyte Type | Typical Examples | Common Mobile Ions | Notes for TMO Electrochromic SW |
|---|---|---|---|
| Liquid/liquid-polymer electrolytes (LPEs) [180] | Propylene carbonate (PC), polyethylene glycol (PEG), polyethylene oxide (PEO) with salts such as LiClO4, LiI, LiTFSI, LiPF6 | Mainly Li+ | High ionic conductivity and easy processing, but limited by leakage, evaporation, bubble formation, and sealing/safety issues |
| Gel polymer electrolytes (GPEs)/quasi-solid electrolytes [180,181] | PVDF-HFP-based gels, PEGDA/PEO gels, UV-cured PMMA gels, ion gels | Mainly Li+ | High ionic conductivity, better mechanical stability, and reduced leakage; common in WO3/NiO devices |
| Solid polymer electrolytes (SPEs) [180] | PMMA, gelatin, methyl-cellulose-based electrolytes, bio-based polymer electrolytes | Li+ or H+ | Attractive for all-solid-state SWs because they eliminate leakage and simplify lamination/packaging, although conductivity can be lower than in liquid systems |
| Inorganic solid electrolytes [180,182] | Ta2O5, Li:Ta2O5, LiAlSiO4, phosphate glass, related oxide/ceramic ion conductors | H+, Li+, Na+ depending on composition | Important in all-solid-state SWs because they offer good film integration, durability, and device stability |
| Hybrid organic–inorganic polyelectrolytes [183] | Sol–gel-derived hybrid electrolytes, ORMOLYTE-type materials, siloxane-based hybrid polyelectrolytes | Mainly Li+ | Designed to combine the mechanical robustness of inorganic networks with the processability and flexibility of polymers; reported in NiO/WO3 complementary devices |
| Manufacturer | Product Name | Maximum Size (mm) | Range | Range |
|---|---|---|---|---|
| SageGlass www.sageglass.com (accessed date: 19 May 2026) | SageGlass Clear DGU | |||
| SageGlass Blue DGU | ||||
| View https://view.com/ (accessed date: 19 May 2026) | View Gen 4 DGU–Clear | |||
| View Gen 4 DGU–Clear + SN68 low-e | ||||
| View Gen 4 Laminated DGU–clear/ PVB/clear | ||||
| View Gen 4 TGU–Clear | ||||
| View Gen 4 TGU–Clear + SN68 low-e | ||||
| Vitrum Glass Group https://www.vitrum.ca/ (accessed date: 19 May 2026) | Halio | – | ||
| Halio Black | – | |||
| ConverLight https://converlight.com/ (accessed date: 19 May 2026) | ConverLight Dynamic 75 2G | |||
| ConverLight Dynamic 75 3G | ||||
| ConverLight Dynamic 65 3G | ||||
| ConverLight Dynamic 65 4G |
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Ghilețchii, G.; Varzari, A.; Irimiciuc, Ş.-A.; Lančok, J.; Vatavu, S. An Overview of Chromic Transition Metal Oxide Thin Films. Materials 2026, 19, 2943. https://doi.org/10.3390/ma19142943
Ghilețchii G, Varzari A, Irimiciuc Ş-A, Lančok J, Vatavu S. An Overview of Chromic Transition Metal Oxide Thin Films. Materials. 2026; 19(14):2943. https://doi.org/10.3390/ma19142943
Chicago/Turabian StyleGhilețchii, Gheorghe, Alexandru Varzari, Ştefan-Andrei Irimiciuc, Ján Lančok, and Sergiu Vatavu. 2026. "An Overview of Chromic Transition Metal Oxide Thin Films" Materials 19, no. 14: 2943. https://doi.org/10.3390/ma19142943
APA StyleGhilețchii, G., Varzari, A., Irimiciuc, Ş.-A., Lančok, J., & Vatavu, S. (2026). An Overview of Chromic Transition Metal Oxide Thin Films. Materials, 19(14), 2943. https://doi.org/10.3390/ma19142943

