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Volume 18
Issue 16
10.3390/ma18163882
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This is an early access version, the complete PDF, HTML, and XML versions will be available soon.
Article

High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization

by
Qiang Wang
1,2,†,
Zhijie Ye
3,†,
Lei Liu
1,†,
Jie Bai
1,2,*,
Yuning Zhao
1,
Qiang Hu
4,
Hong Liu
4,
Lang Hu
4,
Xiaodong Guo
4,
Yongneng Xiao
4,
Wenxin Cao
3,* and
Zhenhuai Yang
4,*
1
School of Aeronautics, Chongqing Jiaotong University, Chongqing 400074, China
2
Key Laboratory of Low-Grade Energy Utilization Technologies and Systems, Chongqing University, Ministry of Education, Chongqing 400044, China
3
Zhengzhou Research Institute, Harbin Institute of Technology, Zhengzhou 450000, China
4
Laboratory of Microwave and Vacuum Technology, Jihua Laboratory, Foshan 528200, China
*
Authors to whom correspondence should be addressed.
†
These authors contributed equally to this work.
Materials 2025, 18(16), 3882; https://doi.org/10.3390/ma18163882
Submission received: 2 July 2025 / Revised: 3 August 2025 / Accepted: 15 August 2025 / Published: 19 August 2025
(This article belongs to the Section Advanced Composites)
Versions Notes

Abstract

Diamond–copper composites, due to their exceptional thermal conductivity, hold significant potential in the field of electronic device thermal management. Hot-press sintering is a promising fabrication technique with industrial application prospects; however, the thermal conductivity of composites prepared by this method has yet to reach optimal levels. In this study, tungsten was deposited on the surface of diamond particles by magnetron sputtering as an interfacial transition layer, and hot-press sintering was employed to fabricate the composites. The findings reveal that with prolonged annealing time, tungsten gradually transformed into W2C and WC, significantly enhancing interfacial bonding strength. When the diamond volume content was 50% and the interfacial coating consisted of 2 wt.% W, 92 wt.% WC, and 6 wt.% W2C, the composite exhibited a thermal conductivity of 640 W/(m·K), the highest value reported among hot-press sintered composites with diamond content below 50%. Additionally, the AMM (Acoustic Mismatch Model) and DMM (Diffusion Mismatch Model) models were utilized to calculate the interfacial thermal conductance between different phases, identifying the optimal interfacial structure as diamond/W2C/WC/W2C/Cu. This composite material shows potential for application in high-power electronic device cooling, thermal management systems, and thermoelectric conversion, providing a more efficient thermal dissipation solution for related devices.
Keywords: diamond–copper composites; thermal conductivity; interfacial thermal conductance; hot-pressing diamond–copper composites; thermal conductivity; interfacial thermal conductance; hot-pressing

Share and Cite

MDPI and ACS Style

Wang, Q.; Ye, Z.; Liu, L.; Bai, J.; Zhao, Y.; Hu, Q.; Liu, H.; Hu, L.; Guo, X.; Xiao, Y.; et al. High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization. Materials 2025, 18, 3882. https://doi.org/10.3390/ma18163882

AMA Style

Wang Q, Ye Z, Liu L, Bai J, Zhao Y, Hu Q, Liu H, Hu L, Guo X, Xiao Y, et al. High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization. Materials. 2025; 18(16):3882. https://doi.org/10.3390/ma18163882

Chicago/Turabian Style

Wang, Qiang, Zhijie Ye, Lei Liu, Jie Bai, Yuning Zhao, Qiang Hu, Hong Liu, Lang Hu, Xiaodong Guo, Yongneng Xiao, and et al. 2025. "High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization" Materials 18, no. 16: 3882. https://doi.org/10.3390/ma18163882

APA Style

Wang, Q., Ye, Z., Liu, L., Bai, J., Zhao, Y., Hu, Q., Liu, H., Hu, L., Guo, X., Xiao, Y., Cao, W., & Yang, Z. (2025). High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization. Materials, 18(16), 3882. https://doi.org/10.3390/ma18163882

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