Order Article Reprints

Wang Q, Ye Z, Liu L, Bai J, Zhao Y, Hu Q, Liu H, Hu L, Guo X, Xiao Y, et al. High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization. Materials. 2025; 18(16):3882. https://doi.org/10.3390/ma18163882

Wang, Qiang, Zhijie Ye, Lei Liu, Jie Bai, Yuning Zhao, Qiang Hu, Hong Liu, Lang Hu, Xiaodong Guo, Yongneng Xiao, and et al. 2025. "High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization" Materials 18, no. 16: 3882. https://doi.org/10.3390/ma18163882

Wang, Q., Ye, Z., Liu, L., Bai, J., Zhao, Y., Hu, Q., Liu, H., Hu, L., Guo, X., Xiao, Y., Cao, W., & Yang, Z. (2025). High Thermal Conductivity Diamond–Copper Composites Prepared via Hot Pressing with Tungsten–Coated Interfacial Layer Optimization. Materials, 18(16), 3882. https://doi.org/10.3390/ma18163882