Jiang, W.; Wang, C.; Han, K.; Zhu, Y.; Hou, C.; Xing, R.
Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys. Materials 2025, 18, 2596.
https://doi.org/10.3390/ma18112596
AMA Style
Jiang W, Wang C, Han K, Zhu Y, Hou C, Xing R.
Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys. Materials. 2025; 18(11):2596.
https://doi.org/10.3390/ma18112596
Chicago/Turabian Style
Jiang, Wen, Changwei Wang, Kangning Han, Yaxin Zhu, Chuantao Hou, and Ruisi Xing.
2025. "Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys" Materials 18, no. 11: 2596.
https://doi.org/10.3390/ma18112596
APA Style
Jiang, W., Wang, C., Han, K., Zhu, Y., Hou, C., & Xing, R.
(2025). Impact of Annealing Treatment on the Microstructure and Micromechanical Properties of Pb-Containing and Pb-Free Solder Alloys. Materials, 18(11), 2596.
https://doi.org/10.3390/ma18112596