Mladenović, I.O.; Lamovec, J.S.; Vasiljević-Radović, D.G.; Vasilić, R.; Radojević, V.J.; Nikolić, N.D.
Evaluation of Adhesion Properties of Electrodeposited Copper Thin Films: Theoretical and Experimental Approach. Materials 2025, 18, 2480.
https://doi.org/10.3390/ma18112480
AMA Style
Mladenović IO, Lamovec JS, Vasiljević-Radović DG, Vasilić R, Radojević VJ, Nikolić ND.
Evaluation of Adhesion Properties of Electrodeposited Copper Thin Films: Theoretical and Experimental Approach. Materials. 2025; 18(11):2480.
https://doi.org/10.3390/ma18112480
Chicago/Turabian Style
Mladenović, Ivana O., Jelena S. Lamovec, Dana G. Vasiljević-Radović, Rastko Vasilić, Vesna J. Radojević, and Nebojša D. Nikolić.
2025. "Evaluation of Adhesion Properties of Electrodeposited Copper Thin Films: Theoretical and Experimental Approach" Materials 18, no. 11: 2480.
https://doi.org/10.3390/ma18112480
APA Style
Mladenović, I. O., Lamovec, J. S., Vasiljević-Radović, D. G., Vasilić, R., Radojević, V. J., & Nikolić, N. D.
(2025). Evaluation of Adhesion Properties of Electrodeposited Copper Thin Films: Theoretical and Experimental Approach. Materials, 18(11), 2480.
https://doi.org/10.3390/ma18112480