Huang, J.-H.; Shih, P.-S.; Renganathan, V.; Gräfner, S.J.; Lin, Y.-C.; Kao, C.-L.; Lin, Y.-S.; Hung, Y.-C.; Kao, C.R.
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. Materials 2024, 17, 1638.
https://doi.org/10.3390/ma17071638
AMA Style
Huang J-H, Shih P-S, Renganathan V, Gräfner SJ, Lin Y-C, Kao C-L, Lin Y-S, Hung Y-C, Kao CR.
A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. Materials. 2024; 17(7):1638.
https://doi.org/10.3390/ma17071638
Chicago/Turabian Style
Huang, Jeng-Hau, Po-Shao Shih, Vengudusamy Renganathan, Simon Johannes Gräfner, Yu-Chun Lin, Chin-Li Kao, Yung-Sheng Lin, Yun-Ching Hung, and Chengheng Robert Kao.
2024. "A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications" Materials 17, no. 7: 1638.
https://doi.org/10.3390/ma17071638
APA Style
Huang, J.-H., Shih, P.-S., Renganathan, V., Gräfner, S. J., Lin, Y.-C., Kao, C.-L., Lin, Y.-S., Hung, Y.-C., & Kao, C. R.
(2024). A High Copper Concentration Copper-Quadrol Complex Electroless Solution for Chip Bonding Applications. Materials, 17(7), 1638.
https://doi.org/10.3390/ma17071638
