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Journal: Materials, 2024
Volume: 17
Number: 553

Article: Prediction of Subsurface Microcrack Damage Depth Based on Surface Roughness in Diamond Wire Sawing of Monocrystalline Silicon
Authors: by Keying Wang, Yufei Gao and Chunfeng Yang
Link: https://www.mdpi.com/1996-1944/17/3/553

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