Hung, Y.-W.; La, M.-P.; Lin, Y.-Q.; Chen, C.
Effect of Ag, Sn, and SiCN Surface Coating Layers on the Reliability of Nanotwinned Cu Redistribution Lines Under Temperature Cycling Tests. Materials 2024, 17, 5458.
https://doi.org/10.3390/ma17225458
AMA Style
Hung Y-W, La M-P, Lin Y-Q, Chen C.
Effect of Ag, Sn, and SiCN Surface Coating Layers on the Reliability of Nanotwinned Cu Redistribution Lines Under Temperature Cycling Tests. Materials. 2024; 17(22):5458.
https://doi.org/10.3390/ma17225458
Chicago/Turabian Style
Hung, Yu-Wen, Mai-Phuong La, Yi-Quan Lin, and Chih Chen.
2024. "Effect of Ag, Sn, and SiCN Surface Coating Layers on the Reliability of Nanotwinned Cu Redistribution Lines Under Temperature Cycling Tests" Materials 17, no. 22: 5458.
https://doi.org/10.3390/ma17225458
APA Style
Hung, Y.-W., La, M.-P., Lin, Y.-Q., & Chen, C.
(2024). Effect of Ag, Sn, and SiCN Surface Coating Layers on the Reliability of Nanotwinned Cu Redistribution Lines Under Temperature Cycling Tests. Materials, 17(22), 5458.
https://doi.org/10.3390/ma17225458