Yang, H.; Fu, M.; Zhang, X.; Zhu, K.; Cao, L.; Hu, C.
Material Removal Mechanisms of Polycrystalline Silicon Carbide Ceramic Cut by a Diamond Wire Saw. Materials 2024, 17, 4238.
https://doi.org/10.3390/ma17174238
AMA Style
Yang H, Fu M, Zhang X, Zhu K, Cao L, Hu C.
Material Removal Mechanisms of Polycrystalline Silicon Carbide Ceramic Cut by a Diamond Wire Saw. Materials. 2024; 17(17):4238.
https://doi.org/10.3390/ma17174238
Chicago/Turabian Style
Yang, Huyi, Ming Fu, Xin Zhang, Kailin Zhu, Lei Cao, and Chunfeng Hu.
2024. "Material Removal Mechanisms of Polycrystalline Silicon Carbide Ceramic Cut by a Diamond Wire Saw" Materials 17, no. 17: 4238.
https://doi.org/10.3390/ma17174238
APA Style
Yang, H., Fu, M., Zhang, X., Zhu, K., Cao, L., & Hu, C.
(2024). Material Removal Mechanisms of Polycrystalline Silicon Carbide Ceramic Cut by a Diamond Wire Saw. Materials, 17(17), 4238.
https://doi.org/10.3390/ma17174238