Salinas-Rodríguez, E.; Hernández-Ávila, J.; Cerecedo-Sáenz, E.; Arenas-Flores, A.; Veloz-Rodríguez, M.A.; Toro, N.; Gutiérrez-Amador, M.d.P.; Acevedo-Sandoval, O.A.
Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate—Oxygen System: A Kinetic Approach. Materials 2022, 15, 2354.
https://doi.org/10.3390/ma15072354
AMA Style
Salinas-Rodríguez E, Hernández-Ávila J, Cerecedo-Sáenz E, Arenas-Flores A, Veloz-Rodríguez MA, Toro N, Gutiérrez-Amador MdP, Acevedo-Sandoval OA.
Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate—Oxygen System: A Kinetic Approach. Materials. 2022; 15(7):2354.
https://doi.org/10.3390/ma15072354
Chicago/Turabian Style
Salinas-Rodríguez, Eleazar, Juan Hernández-Ávila, Eduardo Cerecedo-Sáenz, Alberto Arenas-Flores, Maria A. Veloz-Rodríguez, Norman Toro, Maria del P. Gutiérrez-Amador, and Otilio A. Acevedo-Sandoval.
2022. "Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate—Oxygen System: A Kinetic Approach" Materials 15, no. 7: 2354.
https://doi.org/10.3390/ma15072354
APA Style
Salinas-Rodríguez, E., Hernández-Ávila, J., Cerecedo-Sáenz, E., Arenas-Flores, A., Veloz-Rodríguez, M. A., Toro, N., Gutiérrez-Amador, M. d. P., & Acevedo-Sandoval, O. A.
(2022). Leaching of Copper Contained in Waste Printed Circuit Boards, Using the Thiosulfate—Oxygen System: A Kinetic Approach. Materials, 15(7), 2354.
https://doi.org/10.3390/ma15072354
