Ong, J.-J.; Chiu, W.-L.; Lee, O.-H.; Chiang, C.-W.; Chang, H.-H.; Wang, C.-H.; Shie, K.-C.; Yang, S.-C.; Tran, D.-P.; Tu, K.-N.;
et al. Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials 2022, 15, 1888.
https://doi.org/10.3390/ma15051888
AMA Style
Ong J-J, Chiu W-L, Lee O-H, Chiang C-W, Chang H-H, Wang C-H, Shie K-C, Yang S-C, Tran D-P, Tu K-N,
et al. Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials. 2022; 15(5):1888.
https://doi.org/10.3390/ma15051888
Chicago/Turabian Style
Ong, Jia-Juen, Wei-Lan Chiu, Ou-Hsiang Lee, Chia-Wen Chiang, Hsiang-Hung Chang, Chin-Hung Wang, Kai-Cheng Shie, Shih-Chi Yang, Dinh-Phuc Tran, King-Ning Tu,
and et al. 2022. "Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces" Materials 15, no. 5: 1888.
https://doi.org/10.3390/ma15051888
APA Style
Ong, J.-J., Chiu, W.-L., Lee, O.-H., Chiang, C.-W., Chang, H.-H., Wang, C.-H., Shie, K.-C., Yang, S.-C., Tran, D.-P., Tu, K.-N., & Chen, C.
(2022). Low-Temperature Cu/SiO2 Hybrid Bonding with Low Contact Resistance Using (111)-Oriented Cu Surfaces. Materials, 15(5), 1888.
https://doi.org/10.3390/ma15051888
