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Journal: Materials, 2022
Volume: 15
Number: 4297

Article: Highly Robust Ti Adhesion Layer during Terminal Reaction in Micro-Bumps
Authors: by Chen-Wei Kao, Po-Yu Kung, Chih-Chia Chang, Wei-Chen Huang, Fu-Ling Chang and C. R. Kao
Link: https://www.mdpi.com/1996-1944/15/12/4297

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