The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics
Abstract
:1. Introduction
2. Kinematic Analysis of LUAG and LTUAG
3. Experimental Details
4. Measurement Method of Actual Amplitude
5. Results and Discussion
5.1. Grinding Force of LTUAG and LUAG
5.2. Surface Roughness of LTUAG and LUAG
6. Conclusions
- (1)
- A new method for measuring the amplitude ratio of torsional to longitudinal vibration by using a PSV laser doppler sensor and a square tool is proposed in this study. The longitudinal–torsional coupled vibration ultrasonic transducer has eight spiral grooves, with each spiral groove measuring 10 mm long by 1 mm wide and 2 mm deep. The spiral groove has a helix angle of 45 degrees, and the amplitude ratio is 0.472.
- (2)
- A method for the real-time measurement of the AA during grinding is proposed. This method can be free from the interferences and influences of external factors, such as tool rotation and cutting fluid. With the experimental setup, the experiments show that the proposed method is effective for AA measurement, and can ensure the consistency of the longitudinal amplitude of LTUAG and LUAG.
- (3)
- When the longitudinal amplitudes of LTUAG and LUAG are the same, the torsional vibration of LTUAG will not increase the trajectory length of the single abrasive. However, the torsional vibration can increase the grinding speed of LTUAG, which reduces the undeformed chip thickness of LTUAG, and the grinding force of LTUAG is smaller than that of LUAG.
- (4)
- Accompanied by a reduction in the undeformed chip thickness, the surface roughness of LTUAG has been effectively improved. Compared with LUAG, the roughness of LTUAG reduced by 1.36 to 9.97%. With the increase in grinding speed and feed speed, the roughness of LTUAG approached the roughness produced by LUAG because the grinding speed of LTUAG was close to that of LUAG.
Author Contributions
Funding
Data Availability Statement
Acknowledgments
Conflicts of Interest
Nomenclature
LUAG | longitudinal ultrasonic vibration-assisted grinding |
LTUAG | longitudinal–torsional coupled ultrasonic vibration-assisted grinding |
CG | conventional grinding |
vs | grinding speed, m/s |
vw | feed speed, mm/min |
ap | grinding depth of cut, μm |
ae | axial depth of cut, mm |
AL | amplitude of longitudinal vibration, μm |
AT | amplitude of torsional vibration, μm |
f | frequency of the ultrasonic tool holder, kHz |
R | radius of the tool, mm |
n | rotating speed of the tool, rpm |
η | amplitude-to-voltage ratio, μm/v |
U | output voltage of the eddy current sensor, v |
θ | torsional angle, rad |
φ | phase difference between longitudinal vibration and torsional vibration, rad |
augmax | maximum undeformed chip thickness, μm |
vmax | maximum grinding speed of LTUAG, m/s |
vmin | minimum grinding speed of LTUAG, m/s |
Kf | reduction rate of the grinding force produced by LTUAG compared to the grinding force produced by LUAG |
M | reduction rate of the surface roughness produced by LTUAG compared to the surface roughness produced by LUAG |
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Properties | Value | Unit |
---|---|---|
SiC content | ≥98 | % |
Density | 3.15 | g/cm3 |
Fracture toughness | 3.2 | MPa·m1/2 |
Vickers hardness | 28 | GPa |
Young’s modulus | 4.1 × 105 | MPa |
Parameters | Value |
---|---|
Grinding speed vs/(m/s) | 1.25, 3.35, 5.03, 6.7, 8.38 |
Feed speed vw/(mm/min) | 100, 400, 700, 1000 |
Grinding depth ap (μm) | 5, 10, 15, 20 |
Radial depth of cut ae (mm) | 2 |
Parameters | Value |
---|---|
Overhang length of the tool (mm) | LUAG: 26 LTUAG: 22 |
Frequency (kHz) | 24.4 |
Actual amplitude (μm) | LUAG: 6 (AL) LTUAG: 6 (AL), 2.8 (AT) |
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Chen, Y.; Su, H.; He, J.; Qian, N.; Gu, J.; Xu, J.; Ding, K. The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics. Materials 2021, 14, 688. https://doi.org/10.3390/ma14030688
Chen Y, Su H, He J, Qian N, Gu J, Xu J, Ding K. The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics. Materials. 2021; 14(3):688. https://doi.org/10.3390/ma14030688
Chicago/Turabian StyleChen, Yurong, Honghua Su, Jingyuan He, Ning Qian, Jiaqing Gu, Jiuhua Xu, and Kai Ding. 2021. "The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics" Materials 14, no. 3: 688. https://doi.org/10.3390/ma14030688
APA StyleChen, Y., Su, H., He, J., Qian, N., Gu, J., Xu, J., & Ding, K. (2021). The Effect of Torsional Vibration in Longitudinal–Torsional Coupled Ultrasonic Vibration-Assisted Grinding of Silicon Carbide Ceramics. Materials, 14(3), 688. https://doi.org/10.3390/ma14030688