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Journal: Materials, 2021
Volume: 14
Number: 4827
4827
Article: The Evolution of Organosilicon Precursors for Low-k Interlayer Dielectric Fabrication Driven by Integration Challenges
Authors: by Nianmin Hong, Yinong Zhang, Quan Sun, Wenjie Fan, Menglu Li, Meng Xie and Wenxin Fu
Link: https://www.mdpi.com/1996-1944/14/17/4827

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