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Journal: Materials, 2021
Volume: 14
Number: 3005
3005
Article: Development of Virtual Metrology Using Plasma Information Variables to Predict Si Etch Profile Processed by SF₆/O₂/Ar Capacitively Coupled Plasma
Authors: by Ji-Won Kwon, Sangwon Ryu, Jihoon Park, Haneul Lee, Yunchang Jang, Seolhye Park and Gon-Ho Kim
Link: https://www.mdpi.com/1996-1944/14/11/3005

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