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Journal: Materials, 2020
Volume: 13
Number: 1191
Article:
Optimal Hot-Dipped Tinning Process Routine for the Fabrication of Solderable Sn Coatings on Circuit Lead Frames
Authors:
by
Ting Yin, Nan Xiang, Guangxin Wang, Baohong Tian, Wanting Sun and Xiaoyu Zhang
Link:
https://www.mdpi.com/1996-1944/13/5/1191
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