Latko-Durałek, P.; Kozera, R.; Macutkevič, J.; Dydek, K.; Boczkowska, A.
Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes. Materials 2020, 13, 4469.
https://doi.org/10.3390/ma13204469
AMA Style
Latko-Durałek P, Kozera R, Macutkevič J, Dydek K, Boczkowska A.
Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes. Materials. 2020; 13(20):4469.
https://doi.org/10.3390/ma13204469
Chicago/Turabian Style
Latko-Durałek, Paulina, Rafał Kozera, Jan Macutkevič, Kamil Dydek, and Anna Boczkowska.
2020. "Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes" Materials 13, no. 20: 4469.
https://doi.org/10.3390/ma13204469
APA Style
Latko-Durałek, P., Kozera, R., Macutkevič, J., Dydek, K., & Boczkowska, A.
(2020). Relationship between Viscosity, Microstructure and Electrical Conductivity in Copolyamide Hot Melt Adhesives Containing Carbon Nanotubes. Materials, 13(20), 4469.
https://doi.org/10.3390/ma13204469