Next Article in Journal
Effects of Sintering Conditions on Structures and Properties of Sintered Tungsten Heavy Alloy
Previous Article in Journal
AlxIn1−xN on Si (100) Solar Cells (x = 0–0.56) Deposited by RF Sputtering
Previous Article in Special Issue
Evaluation of Surface Roughness and Defect Formation after The Machining of Sintered Aluminum Alloy AlSi10Mg
Open AccessArticle

Thermal Sources of Errors in Surface Texture Imaging

1
Division of Metrology and Measurement Systems, Institute of Mechanical Technology, Poznan University of Technology, Piotrowo 3, PL-60965 Poznan, Poland
2
Faculty of Mechanical Engineering and Aeronautics, Rzeszow University of Technology, al. Powstańców Warszawy 12, PL-35959 Rzeszow, Poland
3
IRF-SIC Laboratory, Department of Mathematics, Ibn Zohr University, Nouveau Complexe Universitaire, 80000 Agadir, Morocco
*
Author to whom correspondence should be addressed.
Materials 2020, 13(10), 2337; https://doi.org/10.3390/ma13102337
Received: 6 April 2020 / Revised: 12 May 2020 / Accepted: 15 May 2020 / Published: 19 May 2020
This paper presents the influence of thermal phenomena on areal measurements of surface topography using contact profilometers. The research concerned measurements under controlled and variable environmental conditions. The influence of internal heat sources from profilometer drives and their electronic components was analyzed. For this purpose, a thermal chamber was designed and built. Its task was to maintain and control environmental conditions and, at the same time, separate the profilometer from external disturbances. Heat sources and temperature values for elements and systems were determined. It further enabled for the calculation of the displacements in axes as a function of temperature. The largest displacement in the probe due to internal heat sources for the considered cases occurred in the X-axis direction. Its value reached 16.2 μm. However, the displacement in the probe in the Z-axis direction had the greatest impact on the measured surface topography. These displacements for a thermally unstable profilometer reached 7.9 μm in Z, causing results even 90% greater than in the case of a device without such problems. The time after which a proper topography measurement can be started was also determined basing on obtained data. This time for tested profilometers was between 6 and 12 h. It was found that performing thermal stabilization of the profilometer significantly reduced surface irregularity errors. The stabilization time should be determined individually for a specific type of device. View Full-Text
Keywords: contact profilometry; surface topography; thermal disturbance; thermal expansion; thermal chamber contact profilometry; surface topography; thermal disturbance; thermal expansion; thermal chamber
Show Figures

Figure 1

MDPI and ACS Style

Grochalski, K.; Wieczorowski, M.; Pawlus, P.; H’Roura, J. Thermal Sources of Errors in Surface Texture Imaging. Materials 2020, 13, 2337.

Show more citation formats Show less citations formats
Note that from the first issue of 2016, MDPI journals use article numbers instead of page numbers. See further details here.

Article Access Map by Country/Region

1
Search more from Scilit
 
Search
Back to TopTop