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Journal: Materials, 2019
Volume: 12
Number: 1194
1194
Article: Effect of Aluminum Addition on the Microstructure and Properties of Non-Eutectic Sn-20Bi Solder Alloys
Authors: by Wenchao Yang, Jidong Li, Yitai Li, Junli Feng, Jingwu Wu, Xiankun Zhou, Aihua Yu, Jiahui Wang, Siyu Liang, Mei Wei and Yongzhong Zhan
Link: https://www.mdpi.com/1996-1944/12/7/1194

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